As AI accelerators push toward 1000W TDP with core voltages dropping below 0.7V, power delivery has become one of the most critical challenges in data center infrastructure. Delivering 1400+ amperes to a single chip requires revolutionary approaches to power distribution.
The Low-Voltage, High-Current Problem
Modern GPUs and AI accelerators operate at increasingly lower voltages to reduce power consumption, but this creates severe challenges:
- Resistive Losses: I²R losses increase quadratically with current
- Voltage Drop: Maintaining tight voltage regulation across hundreds of amperes
- Transient Response: AI workloads create rapid load changes requiring fast response
Emerging Solutions
48V Direct-to-Load
Instead of converting from 12V, new architectures deliver 48V directly to the board, performing final conversion closer to the load. This reduces distribution losses by 75%.
Vertical Power Delivery
Intel's PowerVia and TSMC's backside power delivery move power rails to the back of the chip, reducing resistance and improving signal integrity.
Integrated Voltage Regulators
Placing voltage regulators directly in the package or even on-die enables faster transient response and tighter voltage regulation.
Industry Implementation
Major players are deploying next-generation power architectures:
- Google: Custom 48V power distribution in TPU v5 pods
- Meta: Implementing vertical power delivery in custom AI chips
- NVIDIA: Partnering with power module vendors for advanced VR solutions
The evolution of power delivery infrastructure is critical for continued AI scaling, with efficiency improvements of 15-20% possible through architectural changes alone.